Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing

Collaborations at Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems  Collaboration builds on the companies' long history of working together to solve complex semiconductor device scaling challenges SANTA CLARA, Calif., Oct. 06, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced it is working with Intel Corporation (Nasdaq: INTC) to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.